Strength Evaluation of Pb-free Solder Joints with Artificial Aging Time and Test Temperature
نویسندگان
چکیده
منابع مشابه
Pb-Free High Temperature Solder Joints for Power Semiconductor Devices
Three types of inexpensive Pb-free solder joints, namely Zn-based and Bi-based solders, and a CuSn alloy were studied for application to the high-temperature operation of wide band-gap power semiconductor devices using GaN or SiC. Zn– Al solder sheets, whose melting point is 380°C were prepared, and then surface oxides were removed by RF plasma etching. Subsequently, Cu thin films were deposite...
متن کاملFRAGILITY OF Pb-FREE SOLDER JOINTS
Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embr...
متن کاملFragility of Pb-free Solder Joints
Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embr...
متن کاملAging Effects in Sac Solder Joints
The microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal aging and/or thermal cycling environments. In our prior work on aging effects, we have demonstrated that the observed material behavior variations of Sn-Ag-Cu (SAC) lead free solders during room temperature aging (25 C) and elevated...
متن کاملMicrostructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging
Keywords: Shear strength Microstructure Single-shear lap joint Intermetallic compound (IMC) Aging a b s t r a c t The effects of isothermal aging on the microstructure and shear strength of Sn37Pb/Cu solder joints were investigated. Single-lap shear solder joints of eutectic Sn37Pb solder were aged for 1–10 days at 120 °C and 170 °C, respectively, and then loaded to failure in shear with a cons...
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ژورنال
عنوان ژورنال: Transactions of the Korean Society of Automotive Engineers
سال: 2014
ISSN: 1225-6382
DOI: 10.7467/ksae.2014.22.3.090